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November 2005

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From:
"Blomberg, Rainer (FL51)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Blomberg, Rainer (FL51)
Date:
Wed, 30 Nov 2005 09:46:47 -0700
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I think it refers to a "blind" sample, meaning the samples are randomly
picked and "blind" to any particular lot or production, process or part
differences.

> Rainer G. Blomberg
> Honeywell -Space Systems Clearwater
> Staff Production Engineer
(727) 539-5534


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (AZ75)
Sent: Wednesday, November 30, 2005 11:24 AM
To: [log in to unmask]
Subject: Re: [TN] blind build definition

Well, no one answered so I'll take a shot in the dark at it.
First, I would ask Dave " the Duck Hunter " Hillman. If anyone knew how to
build blinds, it would be him.
Second, it could be some interim build-up to test the reliability in a
sequential lamination process for blind vias.
Third, if I asked someone for a blind build of Printed Wiring Boards, it was
because I wanted to test their capabilities. I would want no tweaking of the
processes or Golden Boards to cloud the potential issues. There is enough
nebulous data being generated already. I would want a cumulous of data which
reflected a true processing condition so I could accurately assess their
capabilities and potential first pass yields, so as to avoid cirrius
problems down the road.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Wednesday, November 30, 2005 8:02 AM
To: [log in to unmask]
Subject: [TN] blind build definition

Guys and Gals,
could anyone define a term "blind build" of MFG lot for reliability test?
As my per my limited understanding, the "blind build" mean to be no
electrical test performed after the MFG, therefore, the yield data is part
of the initial assessment of yield upon recieving at the test facility
(doesn't matter if it is in house or external).  However, someone point out
that "blind build" terminology implys that the test die (chip) is not probed
at the waffer supply (un-probed die), that means the initial testing will be
2 yields: the chip yield and assembly yield.  Does any of your gurus can
tell me what is proper definition of "blind build"?  Is there a official
definition?  Thank you very very much.  (I am not try to split hair...
please help me to define...).
Best regards,
                                        jk

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