Well, no one answered so I'll take a shot in the dark at it.
First, I would ask Dave " the Duck Hunter " Hillman. If anyone knew how
to build blinds, it would be him.
Second, it could be some interim build-up to test the reliability in a
sequential lamination process for blind vias.
Third, if I asked someone for a blind build of Printed Wiring Boards, it
was because I wanted to test their capabilities. I would want no
tweaking of the processes or Golden Boards to cloud the potential
issues. There is enough nebulous data being generated already. I would
want a cumulous of data which reflected a true processing condition so I
could accurately assess their capabilities and potential first pass
yields, so as to avoid cirrius problems down the road.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Wednesday, November 30, 2005 8:02 AM
To: [log in to unmask]
Subject: [TN] blind build definition

Guys and Gals,
could anyone define a term "blind build" of MFG lot for reliability
test?
As my per my limited understanding, the "blind build" mean to be no
electrical test performed after the MFG, therefore, the yield data is
part of the initial assessment of yield upon recieving at the test
facility (doesn't matter if it is in house or external).  However,
someone point out that "blind build" terminology implys that the test
die (chip) is not probed at the waffer supply (un-probed die), that
means the initial testing will be
2 yields: the chip yield and assembly yield.  Does any of your gurus can
tell me what is proper definition of "blind build"?  Is there a official
definition?  Thank you very very much.  (I am not try to split hair...
please help me to define...).
Best regards,
                                        jk

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