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November 2005

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From:
Joyce Koo <[log in to unmask]>
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Date:
Wed, 30 Nov 2005 10:02:22 -0500
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Guys and Gals,
could anyone define a term "blind build" of MFG lot for reliability test?
As my per my limited understanding, the "blind build" mean to be no
electrical test performed after the MFG, therefore, the yield data is part
of the initial assessment of yield upon recieving at the test facility
(doesn't matter if it is in house or external).  However, someone point out
that "blind build" terminology implys that the test die (chip) is not probed
at the waffer supply (un-probed die), that means the initial testing will be
2 yields: the chip yield and assembly yield.  Does any of your gurus can
tell me what is proper definition of "blind build"?  Is there a official
definition?  Thank you very very much.  (I am not try to split hair...
please help me to define...).
Best regards,
                                        jk

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