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Date: | Wed, 30 Nov 2005 00:18:26 +0100 |
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Hi Mumtaz,
My reaction is that there seems to be no hole stiffeners.
And the barrels are not uniform.
Inge
-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Mumtaz Bora
Skickat: den 29 november 2005 05:02
Till: [log in to unmask]
Ämne: [TN] Via Cracking in flex cable
Dear All,
We have an issue with flex cables cracking in cellphone
assembly. X-sections are showing voids, some residue and cracking in
the
via. It appears to be a combination of smear remove and copper plating
problem. Any insight from the flex circuit and plating experts will be
appreciated. I have asked Stephen Gregory to post the X-sections on his
website.
Thank-you
Mumtaz
D/ 252 - SMT Process and Component Quality
Bldg. V238E
Voice (858)-882-1967
Fax (858)-882-3126
Page (858)-635-1180
Cell: (858) -449-7054
email: [log in to unmask]
Kyocera-Wireless Corp.
10300, Campus Point Drive
San Diego, Ca 92121,USA
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