Jk,
We have experimented with  comparing soldered vs 'glued' beamlead
transistors working as high as 30 GHz, and we saw no difference in TDR
or whatsoever highspeed parameters. The trick was to obtain 30um dots.
Ordinary dots would drown the component. We used ordinary 1LMI. The
flake distribution ought to be 0.1 - 5 micrometers for managing the
superfine syringes. 1LMI is not the best one from this standpoint.

 But, it's nothing for high speed mass production, believe me.
Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Joyce Koo
Skickat: den 28 november 2005 21:51
Till: [log in to unmask]
Ämne: [TN] flex adhesive

does anyone got a good reference regarding the flex adhesive type
(acrylic,
epoxy, F-polymer, etc.etc) impact on high speed interconnect performance
(like TDR structures)?  Really appreciated.
Best regards,
                      jk

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