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November 2005

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Subject:
Re: reballing bga
From:
"Crepeau, Phil (Space Technology)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Crepeau, Phil (Space Technology)
Date:
Mon, 28 Nov 2005 12:35:40 -0800
Content-Type:
text/plain
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text/plain (65 lines) 
wow,

that was a comprehensive response.

thanks much,

phil 

-----Original Message-----
From: Stadem, Richard [mailto:[log in to unmask]] 
Sent: Monday, November 28, 2005 12:06 PM
To: TechNet E-Mail Forum; Crepeau, Phil (Space Technology)
Subject: RE: [TN] reballing bga

Start with IPC 7095, par. 4.3.1 through 5.2 which covers the part
itself; standard package, fine pitch package, fine-pitch rectangular
package, Die-sized packaging, ball-pitch, land-pattern approximation (on
the BGA interposer board), component packaging style considerations,
solder alloy composition, final finish of BGA laminate, ball attach
process, ceramic (alumina) substrate considerations, CCGA's, BGA
construction materials, alignment marks, etc, ad nauseum. Also check out
JEDEC Publication JEP95, which has much more info. J-STD-001 has the end
requirements for the assembly of the new BGA to the board. Acceptable
voiding is covered in both, but they conflict.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Crepeau, Phil (Space
Technology)
Sent: Monday, November 28, 2005 1:33 PM
To: [log in to unmask]
Subject: [TN] reballing bga

hi,

we may have a need to take nickel, palladium, gold balls on new bga's
and replace them with snpb balls.  is there an ipc spec that defines the
end product requirements for this process?  for example, voids, wetting,
uniformity, delamination, and on and on?

thanks,

phil

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