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November 2005

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Subject:
From:
"Stadem, Richard" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard
Date:
Mon, 28 Nov 2005 12:05:17 -0600
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MEMS and MOEMS will become more and more common with advances in the
nanosciences. In my last job I was working with MEMS that have a
spinning gyroscope as the nanostructure. Your customer will (should)
demand lots of different qualifications that will need to be done to
your production process, as most MEMS are extremely susceptible to
repeated shock and vibration and thermal expansion. You will need to
qualify an entire process from the time they leave the component vendor,
transportation methods, through receiving inspection, through the pick
and place machine, through the reflow and the wash (the wash is the
toughest part to characterize and qualify), test, and finally packaging
and shipping. In order to do this you need real-time monitoring of shock
and vibration, and you need excellent material handling, ESD, and MSD
controls in place.
The qualification involves knowing the history of shock and vibration
levels seen throughout the process, and being able to correlate them to
component reliability through failure analysis techniques later. This
determines the limits of shock/vibration to put on the component parts
print. You will be working with the customer's design and component
applications engineer, the component vendor, and many others to develop
the handling and assembly methods from beginning to end.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Monday, November 28, 2005 9:37 AM
To: [log in to unmask]
Subject: [TN] MEMS

Hi Technos,

I would like to know how you feel about MEMS. Do you see any drive from
your customers to integrate this with your regular production? Will this
kind of drive be reality or electronics assembly will continue to be a
different world?

Thanks,
Ioan

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