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November 2005

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Subject:
From:
Peter Lee <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Peter Lee <[log in to unmask]>
Date:
Sun, 27 Nov 2005 23:54:12 -0800
Content-Type:
text/plain
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text/plain (23 lines)
Technet,

I am looking for general design guidelines on thermal vias. Can someone
please let me know if there's any reference material available?

My customer has question on ways to direct maximum heat away from the bottom
side of SMT LEDs. The LEDs all have a 0.4" diameter base, flat on the
bottom. The PCB currently has 0.4" round pads which we paste and solder the
LEDs directly onto.

Rgds,
Peter

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