> Dear Sir or Madam,
>
> I would like to ask if there is a standard which specifies the maximum
> allowable paste print offset both for lead-rich and lead free processes to
> guarantee a correct solder joint after reflow.
>
> I know three could be quite a number of contributors (variables) which
> have direct influence on the quality of the joint after reflow (for a
> given maximum print offset) such as the pad finish, flux chemistry and
> paste used and pad geometries.  However if you know of any standard which
> summarises to the worst conditions and gives a maximum allowable print
> offset,  I would be very grateful if you quote.
>
>
> Regards
>
> Brian Pulis
> Process Engineer
>
> Dedicated Micros Malta Ltd.
> UB2, San Gwann Industrial Estate,
> SGN 09. MALTA.
>
> Tel: (+356)23819 187/199
>
> Fax: (+356)23819 100
>
>

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