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November 2005

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Subject:
From:
Cheryl Johnson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Cheryl Johnson <[log in to unmask]>
Date:
Wed, 23 Nov 2005 13:57:30 -0700
Content-Type:
text/plain
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text/plain (183 lines)
Boys, boys, let's play nice...
Have a happy thanksgiving - and help your wife's tomorrow...

Sincerely,
-----------------------------------
Cheryl Johnson, C.I.D.+
Manager
ExcelStor US Office, Engineering Services
Email: [log in to unmask]
Tel: (303) 684-7291
Fax: (303) 684-7268
Mobile: (303) 809-5815
-----------------------------------


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of John Burke
Sent: Wednesday, November 23, 2005 1:41 PM
To: [log in to unmask]
Subject: Re: [TN] Lead Free BGAs


Aaaaaaaaargh.

You are supposed to put it in an insulated box????????????

Where's that instruction book.............

John....................8-)

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
Sent: Wednesday, November 23, 2005 12:25 PM
To: [log in to unmask]
Subject: Re: [TN] Lead Free BGAs

Jason, you have been exposed! Now you're going to have to really work for a
living, and find out which way the thermocouples go into that thingamajig.
And don't forget to put it in the insulative box when you send it through
the oven! :)

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jason Gregory
Sent: Wednesday, November 23, 2005 2:00 PM
To: [log in to unmask]
Subject: Re: [TN] Lead Free BGAs

 "People run Sn/Pb profiles way too hot so that they don't have to do any
process development."

Holy Crap! And all these years, I thought I had to actually run profile
experiments.

205 is a little cold for me. I run 215 +/- 5, while always leaning towards
the + side.


Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)212-0844 cell
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joel Mearig
Sent: Wednesday, November 23, 2005 1:19 PM
To: [log in to unmask]
Subject: Re: [TN] Lead Free BGAs

Werner,
I am not wrong. People run Sn/Pb profiles way too hot so that they don't
have to do any process development. If all of your solder joints reach a max
of 205degC you will form a very good and reliable solder joint. I have
proven this in my own process experience without any reliability issues.

I am, however, not so naïve that I think there are no thermal gradients but
in my experience the BGA solder joints tend to be the coolest on the board
and if those are peaking at 217degC the majority of the solder joints on the
balance of the board are getting too hot.

Joel Mearig
Delta Tau Data Systems, Inc.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Wednesday, November 23, 2005 9:59 AM
To: [log in to unmask]
Subject: Re: [TN] Lead Free BGAs

Hi Joel,
Unfortunately, you are wrong. The Sn/Pb profile peak should minimum at
203degC for 5 seconds at the slowest heating SJ, which makes most of the
rest of the assembly hotter.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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