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November 2005

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Subject:
From:
"Stadem, Richard" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard
Date:
Wed, 23 Nov 2005 14:25:18 -0600
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Jason, you have been exposed! Now you're going to have to really work for a living, and find out which way the thermocouples go into that thingamajig. And don't forget to put it in the insulative box when you send it through the oven! :)

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jason Gregory
Sent: Wednesday, November 23, 2005 2:00 PM
To: [log in to unmask]
Subject: Re: [TN] Lead Free BGAs

 "People run Sn/Pb profiles way too hot so that they don't have to do any process development."

Holy Crap! And all these years, I thought I had to actually run profile experiments.

205 is a little cold for me. I run 215 +/- 5, while always leaning towards the + side. 


Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)212-0844 cell
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joel Mearig
Sent: Wednesday, November 23, 2005 1:19 PM
To: [log in to unmask]
Subject: Re: [TN] Lead Free BGAs

Werner,
I am not wrong. People run Sn/Pb profiles way too hot so that they don't have to do any process development. If all of your solder joints reach a max of 205degC you will form a very good and reliable solder joint. I have proven this in my own process experience without any reliability issues.

I am, however, not so naïve that I think there are no thermal gradients but in my experience the BGA solder joints tend to be the coolest on the board and if those are peaking at 217degC the majority of the solder joints on the balance of the board are getting too hot.

Joel Mearig
Delta Tau Data Systems, Inc.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Wednesday, November 23, 2005 9:59 AM
To: [log in to unmask]
Subject: Re: [TN] Lead Free BGAs

Hi Joel,
Unfortunately, you are wrong. The Sn/Pb profile peak should minimum at 203degC for 5 seconds at the slowest heating SJ, which makes most of the rest of the assembly hotter.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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