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November 2005

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Subject:
From:
Joel Mearig <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joel Mearig <[log in to unmask]>
Date:
Wed, 23 Nov 2005 09:36:59 -0800
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The article indicates that a typical Sn/Pb profile peaks at 220degC. I don't
think anyone should be running Sn/Pb that hot. You don't need to be 40degC
above reflow to form a reliable solder joint. I think a Sn/Pb profile should
max at 205degC.

I wonder if the experimental results would change if he ran a cooler (and in
my opinion more appropriate) profile.

Joel Mearig
Delta Tau Data Systems, Inc.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Wednesday, November 23, 2005 7:07 AM
To: [log in to unmask]
Subject: [TN] Lead Free BGAs

>       Tin/Silver BGAs balls forces oven profiles to be increased so
> that the ball collapses and creates a good SJ when using tin/lead
> solder, according to this article.
>       Regards,
>       Ramon
>
>
>               http://www.empf.org/empfasis/jan05/help0105.htm

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