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November 2005

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Subject:
From:
"Stadem, Richard" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard
Date:
Wed, 23 Nov 2005 07:43:30 -0600
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text/plain
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text/plain (51 lines)
Werner, how does this process work? How are the solder balls put on? And
how do you un-solder the part without touching it, other than by using
hot-air solder pencil? It must be some type of Unicum process, perhaps?
;)

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Tuesday, November 22, 2005 1:26 PM
To: [log in to unmask]
Subject: Re: [TN] Making existing PWB land areas larger

Hi 'bogert4,'
You may consider another option--use a high-Pb high melt point solder
ball under each metalization. That way you neeed not touch the component
if manual de-soldering is necessary, and you get a ore reliable solder
connection as well.



Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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