David brings up many very good points, and one of them is the moisture
absorption rates.
I have started to treat all of the pwb's as just another Moisture
Sensitive Device, because they are. One has to review the board
packaging, internal handling and storage practices, and other issues
that become much more critical at 250 C. than they were at 210 C. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Greig
Sent: Wednesday, November 02, 2005 2:29 PM
To: [log in to unmask]
Subject: Re: [TN] board material for high temp

Oops, should have said /98.

Slash sheets are better than nothing, but I always find them playing the
lowest denometer and not going far enough to be a tight description of
all the material parameters that we are usually face with.
For example, Dk and Df over say 1MHz to 1GHz(or 10GHz) and at a specific
resin content.
Volume and surface resistivites that are closer to real materials would
be really useful for sensitive analog designs.


Best Regards

David Greig
______________________________
GigaDyne Ltd
http://www.gigadyne.co.uk
______________________________

-----Original Message-----
From: David Greig [mailto:[log in to unmask]]
Sent: 02 November 2005 19:29
To: 'TechNet E-Mail Forum'; 'James TerVeen'
Subject: RE: [TN] board material for high temp

4101A/96 would be a good starting point, until 4101B comes out. Look for
phenolic resin or non-dicy systems.
All the majors have newish materials. Td >= 300 is a useful metric, and
I assume that all 4101B sheets will have this and Tg as well (what about
having relative moisture absorption rates?).

Best Regards

David Greig
______________________________
GigaDyne Ltd
http://www.gigadyne.co.uk
______________________________

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James TerVeen
Sent: 02 November 2005 19:14
To: [log in to unmask]
Subject: [TN] board material for high temp

What does everyone us for board material for High temperature solder
applications.   We have a new product that will require the use of high
temperature solder.   Will the use of conventional FR4 be sufficient.

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