Thanks. The solder joint is OK. problem is in replacing the parts that fail using hand iron. Werner suggested using high lead solder ball under the part terminations as an alternative to larger pads.
----- Original Message -----
From: Michael McMonagle<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Tuesday, November 22, 2005 8:09 AM
Subject: Re: [TN] Making existing PWB land areas larger
Bogert,
Are the pads too small to make contact at all or too small to
provide a proper fillet at the ends of the component? If you are making
contact between the pad and the bottom of the termination, you're probably
better off to just leave it alone as it is. If you can get an interfacial
connection between the pad and the bottom of the component termination, you
can get a physically decent joint that will hold up to normal usage. Been
there, done that. If the product is subject to a severe use environment, or
Class 3, it might not measure up for the long haul.
The customer designed the board incorrectly; they've got to make the
call. Trying to 'band-aid' a larger pad on to the existing one will be labor
intensive, and will reduce reliability overall. If you've just got to do it,
check out Circuit Technology Center at http://www.circuittechctr.com/<http://www.circuittechctr.com/>
Mike McMonagle
Quality Engineer
OYO Geospace
7007 Pinemont Drive
Houston, TX 77040
713-986-8650
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of - Bogert
Sent: Tuesday, November 22, 2005 4:27 AM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: [TN] Making existing PWB land areas larger
November 22, 2005
Folks we have an OEM who designed a PWB with too small a land area for
mounting a surface mount tantalum chip capacitor. This design does not
allow for replacing the capacitor via manual soldering with an iron since
the part will be damaged if the iron touches the part body. Is there a way
to enlarge the existing land size by some type of solder on land piece. I
know they make such an item that folks use for replacement of damaged
traces. If the lands can be increased in size,
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how does one do this and will a reliable solder connection result?
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