TECHNET Archives

November 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Franklin Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Franklin Asbell <[log in to unmask]>
Date:
Tue, 22 Nov 2005 16:55:00 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (90 lines)
You may be describing edge plating, I'll explain.

There are times when a connection needs to be made from the top to the
bottom of a board and the only real estate is the board edge.

The board is processed normally until electroless copper where it is routed
to expose the edge needing the connection.

The board/panel is processed normally through final rout.

At it's completion those areas routed before 1st copper now have an
electrical connection between the top and bottom.

When viewed from the top/side it can appear as though metal were formed or
wrapped around the edge I suppose.

Franklin

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roland Jaquet
Sent: Tuesday, November 22, 2005 4:45 PM
To: [log in to unmask]
Subject: [TN] Wrap Around Plating

Dear Technetters,

I am a bit confused about a terminology - I checked the archives with no
better understanding.

Wrap Around Plating

The occurrence and usage of those three words are no clear about what is
understood within the PCB industry ..

Are we talking to protective films / masks / resists

Or plating on surface, sides, of feature?

Or about a packaging including embedded features

Is this an other one we don't use but abuse?



Thank you for your help

Best Regards
Rol@nd

www.PCBspecialist.com


Jaquet Roland
Consultant
PCBspecialist
14 Champ Budin
1258 Perly, GENEVA
Switzerland
[log in to unmask]
tel:
fax:
mobile:
41228800405
41228800409
41792033723

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2