Hi folks! Just couldn't sit on my hands any longer. There is couple of
different camps out in the industry right now: 1) Bi is ok; 2) Bi is not
ok. I happen to fall in the (2) category due to type of electronics I work
on - avionics. The JCAA/JGPP consortia is in the middle of failure analysis
of a very large test program. Some of the initial data was reported at the
SMTAI conference in September. The test data definitively shows that small
amounts of Pb and Bi mixing has a detrimental impact on the solder joint
integrity under IPC Class 3 product testing parameters. As part of the
upcoming APEX show the will be additional data available for industry
review on the impact of Bi.  The misinformation that is currently found in
the industry that Bi containing solder alloys or Bi containing component
finishes have no impact on solder joint reliability is incorrect. There are
many IPC Class 2 products where Bi containing solder alloys or Bi
containing component finishes will be perfectly acceptable - the product
design team needs to do their homework to understand how the Bi solder
joint induced integrity degradation will impact their design. As Richard
pointed out - there is additional discussion on this topic in the TechNet
archives.

Dave Hillman
Rockwell Collins
[log in to unmask]




             Richard
             Kraszewski
             <[log in to unmask]                                          To
             COM>                      [log in to unmask]
             Sent by: TechNet                                           cc
             <[log in to unmask]>
                                                                   Subject
                                       Re: [TN] SnBi Lead Plating
             11/02/2005 09:22
             AM


             Please respond to
              TechNet E-Mail
                   Forum
             <[log in to unmask]>
             ; Please respond
                    to
                  Richard
                Kraszewski
             <[log in to unmask]
                   COM>






Lots of information in the archives on this topic which is why I think
no one else responded.

To my way of thinking, it boils down to that with a low Bi (<4%Bi) alloy
its extremely unlikely that any issue will occur, but difficult to
adequately remove this concern from most peoples minds.

In case you haven't seen it already you may find the attached linked
document informative.

http://www.cel.com/pdf/marcomnews/japan_best.pdf


Rich K / KEDS


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Tuesday, November 01, 2005 4:48 PM
To: [log in to unmask]
Subject: Re: [TN] SnBi Lead Plating

Not a mis-communication, it seems to be used a lot for memory devices
particularly.

John

------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
------------------------------------


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bob Barr
Sent: Tuesday, November 01, 2005 1:33 PM
To: [log in to unmask]
Subject: [TN] SnBi Lead Plating


We received a last time buy notice from a distributor for a NEC part.
The
part is going to a RoHS compliant finish. The information we received
seems to indicate the lead finish will be SnBi. With the transition from
Pb to Pb-free still happening, it seems like a problem to have Bi on a
component lead. Everything I have read says Bi cannot be mixed with Pb
because it forms a low temperature melting alloy. Has anybody heard of
Bi
being used in a component lead finish? I'm hoping this may just be a
mis-
communication.

Thanks.

Bob

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