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November 2005

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Subject:
Re: SV: [TN] SV: [TN] [LF] Reliability prediction of LF soldering
From:
Joyce Koo <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Fri, 18 Nov 2005 16:53:05 -0500
Content-Type:
text/plain
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text/plain (48 lines) 
IngeMar,
Not related to the SAC, but related to Ag epoxy (use Ag epoxy replace Pb/Sn
solder, it is Ag epoxy directly bonded on to Pb/Sn plated PCB pad surfaces).
We did find Pb rich interface layer that had weak mechanical properties
(similar to one of the photo of yours).  The formation of Pb rich layer is
due to the preferencial dissolution of Sn into a epoxy material...I think it
was done in 1994/95 time zone...
                                     jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Friday, November 18, 2005 1:54 PM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] [LF] Reliability prediction of LF
soldering


Wow Inge,
I have never seen anything like this. I take these are LF (SAC?) balls?



Werner

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