Lots of information in the archives on this topic which is why I think
no one else responded.

To my way of thinking, it boils down to that with a low Bi (<4%Bi) alloy
its extremely unlikely that any issue will occur, but difficult to
adequately remove this concern from most peoples minds.  

In case you haven't seen it already you may find the attached linked
document informative. 

http://www.cel.com/pdf/marcomnews/japan_best.pdf 


Rich K / KEDS


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Tuesday, November 01, 2005 4:48 PM
To: [log in to unmask]
Subject: Re: [TN] SnBi Lead Plating

Not a mis-communication, it seems to be used a lot for memory devices
particularly.

John

------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
------------------------------------


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bob Barr
Sent: Tuesday, November 01, 2005 1:33 PM
To: [log in to unmask]
Subject: [TN] SnBi Lead Plating


We received a last time buy notice from a distributor for a NEC part.
The
part is going to a RoHS compliant finish. The information we received
seems to indicate the lead finish will be SnBi. With the transition from
Pb to Pb-free still happening, it seems like a problem to have Bi on a
component lead. Everything I have read says Bi cannot be mixed with Pb
because it forms a low temperature melting alloy. Has anybody heard of
Bi
being used in a component lead finish? I'm hoping this may just be a
mis-
communication.

Thanks.

Bob

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