Couple questions regarding the dreaded lead free process. 

 

1.      Do I need to request a different process for PCB fabs, what is
the difference if any?

2.      I understand that lead free components require a higher
temperature and longer reflow time, which may affect other component
reliability.   Not all the components we use are available for lead free
processes. Any recommendations on the processes to be used with a
mixture of leaded vs. lead free? Is this wise? What should we be looking
out for?

3.       I did not want to recreate the wheel, anyone have a test plan
or qualification plan available to qualify this type of process?

4.    And any recommendations on a lead free process class that we could
send a few of our technicians to?

 

Thanks again for your help.

 

 

 

 
 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------