TECHNET Archives

November 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ofer Cohen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ofer Cohen <[log in to unmask]>
Date:
Tue, 15 Nov 2005 12:36:23 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
Hello, all,
Did anyone try to quantify the influence of the LF soldering on the long
term assembly reliability, in terms of MTBF? Is there any work that is
being done on this?

Regards
Ofer Cohen
Manager
Quality Assurance, Reliability and Production Technologies
Seabridge Ltd. - A Siemens Company
Siemens COM FN A SB 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2