The NiPdAu lead finish is widely shown by IC makers as the 2nd choice for a
leadfree package finish, with matte tin being number one, even though the
debate about whiskering with tin continues unabated. Some companies have
made NiPdAu their first choice for packages with long leads where leadfree
SMT solder will not coat the total lead length during reflow. In general,
requests for qualification of IC components with the NiPdAu finish is
increasing, so it is likely that its use will continue to grow and become
more common as we approach July 2006.
Best regards,
Leo
Leo M. Higgins III, Ph.D.
Vice President Technical Support Operations
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
ph 512-383-4593
fx 512-383-1590
[log in to unmask]
www.asat.com
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard
Sent: Monday, November 14, 2005 6:55 AM
To: [log in to unmask]
Subject: Re: [TN] IC's with NiPdAu finish
TI has done this for many years. I have run into some issues with it at
different companies. I do not know if other component companies are also
using it as a terminal finish, but I suspect so.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Greig
Sent: Sunday, November 13, 2005 10:46 AM
To: [log in to unmask]
Subject: [TN] IC's with NiPdAu finish
Hi TN,
Just noticed that TI are using this finish for a great many leadframe
packages (QFP, TSSOP etc).
Is this finish becoming widespread in the industry?
Best Regards
David Greig
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