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November 2005

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 14 Nov 2005 07:54:58 -0600
Content-Type:
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Hi David! The "TI finish" has been in the industry since 1990. Most
everyone understands how it interacts with their processes and are
successfully using it. Typically you need to make some minor reflow profile
changes to accommodate the finish. On occasion there has been an instance
or two of flux/finish incompatibility. You probably have the finish on your
pwa designs and just didn't realize it.

Dave Hillman
Rockwell Collins
[log in to unmask]




             David Greig
             <[log in to unmask]
             O.UK>                                                      To
             Sent by: TechNet          [log in to unmask]
             <[log in to unmask]>                                          cc

                                                                   Subject
             11/13/2005 10:46          [TN] IC's with NiPdAu finish
             AM


             Please respond to
              TechNet E-Mail
                   Forum
             <[log in to unmask]>
             ; Please respond
                    to
                David Greig
             <[log in to unmask]
                   O.UK>






Hi TN,

Just noticed that TI are using this finish for a great many leadframe
packages (QFP, TSSOP etc).

Is this finish becoming widespread in the industry?

Best Regards

David Greig
______________________________
GigaDyne Ltd
Buchan House
Carnegie Campus
Dunfermline KY11 8PL
United Kingdom
t: +44 (0)1383 624 975
www.gigadyne.co.uk <http://www.gigadyne.co.uk/>
______________________________


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