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November 2005

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 11 Nov 2005 08:29:14 -0600
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Hi Joe! I am familiar with what TI has posted on their website but their
addition of a Au flash was more than just a cost saving measure. Pd is a
very cool element and has some unique properties. Pd is a "getter" material
( it is used in catalytic converters) and can form some interesting organic
surface films depending on the use environment - some of the connector
vendors have some interesting stories! Using an Au flash "seals" off the Pd
surface to the formation of the organic films thus enhancing the component
solderability. We have done a bunch of Pd/Ni and Au/Pd/Ni surface finish
testing - it is a great finish for both wirebonding and soldering. Now if
it wasn't so darn expensive in comparison to the other pwb finishes!

Dave



             "Kane, Joseph E
             (US SSA)"
             <joseph.kane@baes                                          To
             ystems.com>               "TechNet E-Mail Forum"
                                       <[log in to unmask]>,
             11/11/2005 08:13          <[log in to unmask]>
             AM                                                         cc

                                                                   Subject
                                       RE: [TN] Gold plated components,
                                       what a pain!!










Dave:

According to TI, they used nickel/palladium until 2001,
then switched over to nickel/palladium/gold to save money.
Price of palladium had risen substantially, and NiPdAu
allowed them to plate thinner palladium.

Here's a link:

http://www.elecdesign.com/rohs/articles/Selecting%20the%20right%20RoHS%2
0finish.pdf

Palladium is a noble metal, so it shouldn't oxidize much,
but then again I've seen something that suggests that the gold
promotes faster wetting and better spread.  Can't find the reference.

-Joe

-----Original Message-----
From: David D. Hillman [mailto:[log in to unmask]]
Sent: Friday, November 11, 2005 8:36 AM
To: [log in to unmask]
Subject: Re: [TN] Gold plated components, what a pain!!


HI Ivan! The purpose of the gold is to "protect" the Pd surface from
reacting with the environment. Pd is a "getter" material and can form a
number of "really neat" surface films, both oxide and/or organic films,
depending on the environment.

Dave Hillman
Rockwell Collins
[log in to unmask]




             Ivanoe Pedruzzi
             <i.pedruzzi@LABEL
             GROUP.COM>
To
             Sent by: TechNet          [log in to unmask]
             <[log in to unmask]>
cc


Subject
             11/11/2005 04:36          Re: [TN] Gold plated components,
             AM                        what a pain!!


             Please respond to
              TechNet E-Mail
                   Forum
             <[log in to unmask]>
             ; Please respond
                    to
              Ivanoe Pedruzzi
             <i.pedruzzi@LABEL
                GROUP.COM>






But Werner,

the 150 A is over Pd, does the Pd have different properties in terms of
oxidization, hence, soldering?

just for my understanding.

THX,
Ivan


Il giorno 10/nov/05, alle ore 23:16, Werner Engelmaier ha scritto:

> I agree that 150 Angstroms of Au "is pretty darn thin"--the problem is

> I see most layer thicknesses in the 500 to 1,000 A range. A 150A layer

> of au would
> not protect the Ni from oxidizing.
>
>
>
> Werner
>
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