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November 2005

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Subject:
From:
"Whittaker, Dewey (AZ75)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (AZ75)
Date:
Fri, 11 Nov 2005 07:27:32 -0700
Content-Type:
text/plain
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text/plain (73 lines)
Randy,
Assuming this is SMOBC, I have used a process which works well for small
areas and may work here if you have no other options.

SS Eraser shield( or equivalent )
No. 4 gray Eberhard ink eraser
Electric eraser

1. Match opening in shield to area to be removed
2. Lightly erase until you see bright copper
3. Clean area with IPA ( or equivalent approved solvent )
4. Pre-tin area with final solder finish of choice
5. Repeat step 3

Area is now OK to solder to or establish a chassis ground point.
This process was tested and approved for Aerospace use.
Dewey





-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Randy Bock Sr.
Sent: Thursday, November 10, 2005 12:53 PM
To: [log in to unmask]
Subject: [TN] Solder Mask Removal

Hey y'all,

We have several hundred boards that are supposed to have  the solder
mask
removed for around a mounting hole on the back side of the board.   The
fab house missed.  We are faced with a total remake if I cannot find
some way to remove the solder mask relatively easy.  Most are still fab
boards,  but I do have some that are assembled.

Any ideas would be appreciated.  The clear area has to be approx 1/2 "
dia.  (is for grounding)

Randy Bock Sr.
Quality  Engineer
Pitney Bowes
AddressRight Printers
(email)  [log in to unmask]
Newtown Building 2
203 270-4931  Ext
    8-426-4931  In
203 270-4982 Fax

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