Dave:
According to TI, they used nickel/palladium until 2001,
then switched over to nickel/palladium/gold to save money.
Price of palladium had risen substantially, and NiPdAu
allowed them to plate thinner palladium.
Here's a link:
http://www.elecdesign.com/rohs/articles/Selecting%20the%20right%20RoHS%2
0finish.pdf
Palladium is a noble metal, so it shouldn't oxidize much,
but then again I've seen something that suggests that the gold
promotes faster wetting and better spread. Can't find the reference.
-Joe
-----Original Message-----
From: David D. Hillman [mailto:[log in to unmask]]
Sent: Friday, November 11, 2005 8:36 AM
To: [log in to unmask]
Subject: Re: [TN] Gold plated components, what a pain!!
HI Ivan! The purpose of the gold is to "protect" the Pd surface from
reacting with the environment. Pd is a "getter" material and can form a
number of "really neat" surface films, both oxide and/or organic films,
depending on the environment.
Dave Hillman
Rockwell Collins
[log in to unmask]
Ivanoe Pedruzzi
<i.pedruzzi@LABEL
GROUP.COM>
To
Sent by: TechNet [log in to unmask]
<[log in to unmask]>
cc
Subject
11/11/2005 04:36 Re: [TN] Gold plated components,
AM what a pain!!
Please respond to
TechNet E-Mail
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<[log in to unmask]>
; Please respond
to
Ivanoe Pedruzzi
<i.pedruzzi@LABEL
GROUP.COM>
But Werner,
the 150 A is over Pd, does the Pd have different properties in terms of
oxidization, hence, soldering?
just for my understanding.
THX,
Ivan
Il giorno 10/nov/05, alle ore 23:16, Werner Engelmaier ha scritto:
> I agree that 150 Angstroms of Au "is pretty darn thin"--the problem is
> I see most layer thicknesses in the 500 to 1,000 A range. A 150A layer
> of au would
> not protect the Ni from oxidizing.
>
>
>
> Werner
>
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