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November 2005

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Tue, 1 Nov 2005 13:48:13 -0800
Content-Type:
text/plain
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text/plain (63 lines)
Not a mis-communication, it seems to be used a lot for memory devices
particularly.

John

------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
------------------------------------


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bob Barr
Sent: Tuesday, November 01, 2005 1:33 PM
To: [log in to unmask]
Subject: [TN] SnBi Lead Plating


We received a last time buy notice from a distributor for a NEC part. The
part is going to a RoHS compliant finish. The information we received
seems to indicate the lead finish will be SnBi. With the transition from
Pb to Pb-free still happening, it seems like a problem to have Bi on a
component lead. Everything I have read says Bi cannot be mixed with Pb
because it forms a low temperature melting alloy. Has anybody heard of Bi
being used in a component lead finish? I'm hoping this may just be a mis-
communication.

Thanks.

Bob

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