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From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 11 Nov 2005 07:36:07 -0600
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HI Ivan! The purpose of the gold is to "protect" the Pd surface from
reacting with the environment. Pd is a "getter" material and can form a
number of "really neat" surface films, both oxide and/or organic films,
depending on the environment.

Dave Hillman
Rockwell Collins
[log in to unmask]




             Ivanoe Pedruzzi
             <i.pedruzzi@LABEL
             GROUP.COM>                                                 To
             Sent by: TechNet          [log in to unmask]
             <[log in to unmask]>                                          cc

                                                                   Subject
             11/11/2005 04:36          Re: [TN] Gold plated components,
             AM                        what a pain!!


             Please respond to
              TechNet E-Mail
                   Forum
             <[log in to unmask]>
             ; Please respond
                    to
              Ivanoe Pedruzzi
             <i.pedruzzi@LABEL
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But Werner,

the 150 A is over Pd, does the Pd have different properties in terms
of oxidization, hence, soldering?

just for my understanding.

THX,
Ivan


Il giorno 10/nov/05, alle ore 23:16, Werner Engelmaier ha scritto:

> I agree that 150 Angstroms of Au "is pretty darn thin"--the problem
> is I see
> most layer thicknesses in the 500 to 1,000 A range. A 150A layer of
> au would
> not protect the Ni from oxidizing.
>
>
>
> Werner
>
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