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November 2005

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Subject:
From:
Roger Tingler <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roger Tingler <[log in to unmask]>
Date:
Thu, 10 Nov 2005 15:53:20 -0500
Content-Type:
text/plain
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text/plain (77 lines)
Randy,

On the Fab boards it would be relatively easy to have a laser ablate the
solder mask opening. Also depending on the component height the laser could
be set up for them to.

Hope that snippet helps

Roger Tingler
Methods Engineer
Colonial Circuits
V:800-578-9602 x102
  540-752-5511x102
F:800-631-0856
  540-752-4832

E-mail: [log in to unmask]

"This document or these discussions contain(s) technical data under U.S.
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Randy Bock Sr.
Sent: Thursday, November 10, 2005 2:53 PM
To: [log in to unmask]
Subject: [TN] Solder Mask Removal

Hey y'all,

We have several hundred boards that are supposed to have  the solder mask
removed for around a mounting hole on the back side of the board.   The
fab house missed.  We are faced with a total remake if I cannot find some
way to remove the solder mask relatively easy.  Most are still fab boards,
 but I do have some that are assembled.

Any ideas would be appreciated.  The clear area has to be approx 1/2 "
dia.  (is for grounding)

Randy Bock Sr.
Quality  Engineer
Pitney Bowes
AddressRight Printers
(email)  [log in to unmask]
Newtown Building 2
203 270-4931  Ext
    8-426-4931  In
203 270-4982 Fax

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