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November 2005

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Subject:
Temperature Cycling
From:
Babcock John <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Babcock John <[log in to unmask]>
Date:
Mon, 7 Nov 2005 16:29:08 -0800
Content-Type:
text/plain
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text/plain (21 lines) 
Does anybody know of any special considerations on circuit boards for
temperature cycling.  We are testing the board to -65C to +85C.  We are
seeing via barrels cracking and TH connector solder joints cracking.  Do
we need to add extra pad area?  Just curious if there is an IPC document
on cold temperatures or temp. cycling and causing stress on the circuit
boards.
 
Thanks!
 
John Babcock

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