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November 2005

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Mon, 7 Nov 2005 14:37:17 -0800
Content-Type:
text/plain
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text/plain (76 lines)
I used to design flip chip on flex, If you would like I can put you in touch
with some engineers in southern California who do this stuff all the time,
and I am sure they can answer most if not all of your questions.

Let me know.

John

------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
------------------------------------


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Wee Mei
Sent: Monday, November 07, 2005 12:45 AM
To: [log in to unmask]
Subject: [TN] Flex Query


Hello,

Looking for answers to the following questions :
1. Beside doing a "doll-house" method to model a 3-D flex design, is there
any CAD software in the market that can do it in a less painful way?
2. What is the highest frequency range a flex material can be used for? or
which flex material currently in the market can achieve 4GHz range?
3. Is there any difference between designing RF & video signal on flex as
compare to rigid?
4. If I have EMI requirement, what would be a better choice?
(a) Shield the critical signals between two ground plane (hatched or full) -
3-layer flex
(b) Critical signals on single flex with two single ground planes - bookbind
method
(c) Critical signals on one side and other side with silver plating -
two-layer flex
(d) other suggestions?

Hope to hear from everyone of you soonest.

Thansk and regards,
Wee Mei.

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