Dear All,
We have an issue with flex cables cracking in cellphone
assembly. X-sections are showing voids, some residue and cracking in the
via. It appears to be a combination of smear remove and copper plating
problem. Any insight from the flex circuit and plating experts will be
appreciated. I have asked Stephen Gregory to post the X-sections on his
website.
Thank-you
Mumtaz
D/ 252 - SMT Process and Component Quality
Bldg. V238E
Voice (858)-882-1967
Fax (858)-882-3126
Page (858)-635-1180
Cell: (858) -449-7054
email: [log in to unmask]
Kyocera-Wireless Corp.
10300, Campus Point Drive
San Diego, Ca 92121,USA
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