IPC and JEDEC have announced the Call for Participation for the 12th
International Conference on Lead Free Electronic Components and
Assemblies, scheduled to take place March 6-8, 2006 in Santa Clara, CA.
Educational courses, as well as a technical conference will be held. IPC
and JEDEC are seeking abstract submissions and workshops/tutorials on
the following relevant subjects.
European lead ban status/policy development
European/Chinese/other legislation or voluntary activity on hazardous
materials and recycling
Legislative compliance and policy enforcement methods
Supply chain issues
Marking and testing standards
Materials declarations, part numbers, obsolescence
Production issues
Design for lead free production
Component, solder, board developments, availability and lead free
compatibility
Examples of implementation
Reflow, wave, hand soldering, inspection, repair, rework, test
Reliability issues
Tin whiskers
Reliability test data and method developments
High reliability product sectors (automotive, aerospace)
Environmental considerations
Toxicity and risk
Recycling
Substitutes for other hazardous substances (Cd, Hg, Hex. Cr)
Research consortia news and updates
Please e-mail your abstract submission or your course proposal to
[log in to unmask] The deadline to submit an abstract or course proposal is
December 6, 2005. Don't miss this opportunity.
Your company also has an opportunity to exhibit at or sponsor part of
this important industry event. For more information on signing up for an
exhibit or a sponsorship opportunity, contact [log in to unmask]
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