Roland,
Plating wrap is a part of the plating that gets placed in a plated
through hole and "wraps" over the surface conductor. There is concern
that during a planarization process (during the creation of buried vias)
that the surface plating is compromised. Experiments have shown that the
reliability of the plated through hole is compromised when this plating
is removed.
Regards,
Gary Ferrari
Ferrari Technical Services
860-350-9300
Roland Jaquet wrote:
> Very confusing, I know edge plating since 20 years but I don't think it is
> the meaning here, I found ..
>
> see: http://www.precisioneagles.com/PrecisionSurface/wrap_around.htm
>
>
>
> Thank you for your help and replies
>
> Meilleures salutations
> Best Regards
> Rol@nd
>
> www.PCBspecialist.com
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
> Sent: Wednesday, November 23, 2005 4:58 AM
> To: [log in to unmask]
> Subject: Re: [TN] Wrap Around Plating
>
> This is also a very good technique for containing the EMI radiation
> component that is produced by the internal circuitry and escapes through
> the edge of the board provided the edge plating is grounded.
>
> Best regards
>
> Lee
>
> J. Lee Parker, Ph.D.
> JLP Consultants LLC
> 804 779 3389
> ----- Original Message -----
> From: Franklin Asbell<mailto:[log in to unmask]>
> To: [log in to unmask]<mailto:[log in to unmask]>
> Sent: Tuesday, November 22, 2005 5:55 PM
> Subject: Re: [TN] Wrap Around Plating
>
>
> You may be describing edge plating, I'll explain.
>
> There are times when a connection needs to be made from the top to the
> bottom of a board and the only real estate is the board edge.
>
> The board is processed normally until electroless copper where it is
> routed
> to expose the edge needing the connection.
>
> The board/panel is processed normally through final rout.
>
> At it's completion those areas routed before 1st copper now have an
> electrical connection between the top and bottom.
>
> When viewed from the top/side it can appear as though metal were formed
> or
> wrapped around the edge I suppose.
>
> Franklin
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Roland Jaquet
> Sent: Tuesday, November 22, 2005 4:45 PM
> To: [log in to unmask]<mailto:[log in to unmask]>
> Subject: [TN] Wrap Around Plating
>
> Dear Technetters,
>
> I am a bit confused about a terminology - I checked the archives with no
> better understanding.
>
> Wrap Around Plating
>
> The occurrence and usage of those three words are no clear about what is
> understood within the PCB industry ..
>
> Are we talking to protective films / masks / resists
>
> Or plating on surface, sides, of feature?
>
> Or about a packaging including embedded features
>
> Is this an other one we don't use but abuse?
>
>
>
> Thank you for your help
>
> Best Regards
> Rol@nd<mailto:Rol@nd>
>
> www.PCBspecialist.com<http://www.pcbspecialist.com/>
>
>
> Jaquet Roland
> Consultant
> PCBspecialist
> 14 Champ Budin
> 1258 Perly, GENEVA
> Switzerland
> [log in to unmask]<mailto:[log in to unmask]>
> tel:
> fax:
> mobile:
> 41228800405
> 41228800409
> 41792033723
>
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