Gentlemen,
I think that your polemics goes to the ground of the situation. If a microscopic model existed, then we could write equations for any material, including all Pb-free alloys. So we could assess reliability of lead-free right away.
But there is no such model and that's why the analytical basis is material specific. We know SnPb, therefore we can predict how it will act based on experiments and models devised to back up the experiments. We will have to create the same analytical base for all the new materials, in order to be able to have independent reliability models, instead of having a general theory from which we can pull anything just by changing the compound.
This seems to be our general quest, Einstein himself was chasing for a unitary theory that would explain all the phenomena around us.
Thanks for the discussion, it is inspiring.
Ioan
> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Vladimir Igoshev
> Sent: Wednesday, November 16, 2005 12:18 PM
> To: [log in to unmask]
> Subject: Re: [TN] [LF] Reliability prediction of LF soldering
>
> Werner,
>
> I knew you wouldn't agree :-).I also knew, you can do it for Pb-Sn solders. However, your predictions will not be based on the microscopic model, but rather on analytical ones, which were sort of "adjusted" to the collected data (from lab experiments and from the field).
>
> Regards,
>
> Vladimir
>
> Vladimir Igoshev, Ph. D.
> Senior Materials Researcher
> Research in Motion
> 451 Phillip St.
> Waterloo, ON, N2L 3X2
>
> Voice: (+1) 519-888-7465, ext. 5283
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>
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Wednesday, November 16, 2005 12:08 PM
> To: Vladimir Igoshev; [log in to unmask]; [log in to unmask]
> Subject: Re: [LF] Reliability prediction of LF soldering
>
>
> Vladimir,
> I respectfully disagree--I have been at this for some 30 years--and I KNOW it works. The reliability of the solder attachments can in fact be estimated depending on the various physical parameters.
>
> Regards,
> Werner Engelmaier
> Engelmaier Associates, L.C.
> Electronic Packaging, Interconnection and Reliability Consulting
> 7 Jasmine Run
> Ormond Beach, FL 32174 USA
> Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
> E-mail: [log in to unmask], Website: www.engelmaier.com
>
>
>
>
>
>
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