Subject: | |
From: | |
Reply To: | |
Date: | Wed, 9 Nov 2005 07:13:50 EST |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Arnaud,
You do not give much of a description of your flex circuit. Thickness? Layer
count? History? Bookbinder folds? Are you sure you have RA copper? It may be
rolled, but not annealed and thus have high ductility in one direction and not
the other. One way to determine that is to do an X-section--long needle-like
grains are an indication opf insufficient annealing. Are there any unassembled
circuits left? You could used IPC TM 2.4.3.2 “Flexural Fatigue and
Ductility, Flexible Metal-Clad Dielectrics.”
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|