Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Thu, 10 Nov 2005 16:14:04 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
John,
I'm in the process or ordering several different laminates for a similar
test. I'd be very interested in your results.
Phil Nutting
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Thursday, November 10, 2005 2:03 PM
To: [log in to unmask]
Subject: [LF] Delamination on lead free reflow cycling
I have been cycling some bare test boards to the JEDEC 020 spec for lead
free reflow trials. I have noticed a tendency for early de-lamination of
areas of the board with copper flood fill on the surface.
This is only occurring after extended cycling, and I have the same
effect
from 3 different board manufacturers using 3 different high temperature
laminate constructions.
Anyone else noticed this??
John
------------------------------------------------------------------------
-------Leadfee Mail List provided as a service by IPC using LISTSERV
1.8d
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks
send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
------------------------------------------------------------------------
-------
-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------
|
|
|