There are a number of companies out there who regularly do this type of
work so it must be profitable.
FYI there are also companies who reclaim IC's from waste equipment, test
them and then they go back into the supply chain for making low grade
electronic toys - not everyone is using a 300C 10mm soldering iron to do
their rework obviously.
Regards,
Chris
____________________________________________________
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Smith, Rick
Sent: 04 November 2005 14:55
To: [log in to unmask]
Subject: Re: [LF] Making IC's RoHS Compliant
I think you guys are all nuts, or bordering on it.
After you handle these parts, striping the lead off and re-tinning, many
if not most of the parts will be damaged or stressed from handling, ESD,
heat, and then you need to figure how to verify all the lead is out;
And, you don't even know how many will survive without delaminating in
the higher reflow temperatures.
Just my thoughts..
Rick Smith
Senior Materials & Process Engineer
Phone: (512)652-3544
Fax: (512)652-3545
Cell: (512)299-6925
Email: [log in to unmask]
ClearCube Technology, Inc
8834 Capital of Texas Hwy N
Austin, TX 78759
www.clearcube.com
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Friday, November 04, 2005 2:15 AM
To: [log in to unmask]
Subject: Re: [LF] Making IC's RoHS Compliant
I don't think you are right. The tinning is done after the packet is
moulded, in my experience. It would be very hazardous to mould a
thermosetting polymer over a tin-lead alloy, which can easily creep,
destroying the hermeticity.
Brian
to Paul Taylor wrote:
> Doug
>
> Stripping and re-tinning the leads does the outside of the IC, but
unless
> you aim to split the IC's down the middle!! then there will be lead
> trapped in the leadframe under the epoxy. This would constitute a
fail in
> RoHS.
> I suggest you either put pressure on you IC manufacturer to supply in
a
> RoHS compliant leadframe or re-design. Better get your skates on,
there
> is not much time left.....(re-design, re-qualify etc)
> Also I agree with Doug Rohm, it would have to survive the higher
> temperatures
> Better get that CAD package out....
>
> regards
> Paul
>
>
> Paul R Taylor
> Senior Engineer, RoHS Compliancy Group, IED
> Pitney Bowes Ltd
> The Pinnacles, Elizabeth Way, Harlow, Essex, CM19 5BD
> tel: +44 1279 449 744 fax +44 1279 449 594
> email: [log in to unmask] website: www.pb.com
>
>
>
> "Douglas, Scott" <[log in to unmask]>
> Sent by: Leadfree <[log in to unmask]>
> 27/10/2005 20:38
> Please respond to
> "(Leadfree Electronics Assembly Forum)" <[log in to unmask]>; Please
respond
> to
> "Douglas, Scott" <[log in to unmask]>
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [LF] Making IC's RoHS Compliant
>
>
>
>
>
>
> Dear Group,
>
> We are looking for a way to avoid re-designing a number of PWB to
replace
> non-RoHS compliant IC's with other compliant (not drop-in replacement)
> parts. In a discussion today with our component engineer, we wondered
if
> we could take our stock of non-RoHS compliant IC's, send them to some
lab
> someplace, have them (dip, acid etch, whatever) remove the tin/lead
solder
> plating the leads and then have the leads re-plated with lead-free
solder.
> This assumes a plastic or ceramic package with standard metal leads,
maybe
> through hole, maybe surface mount. Could we do this and then claim to
be
> RoHS compliant? Anything else we should think about in this?
>
> Scott Douglas, NCE
> Compliance Engineer
> Harman Specialty Group
> 3 Oak Park Drive
> Bedford, MA 01730
> Phone: (781) 280-0406
> Email: [log in to unmask]
> Web: www.harmanspecialtygroup.com
>
>
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