Doug
Stripping and re-tinning the leads does the outside of the IC, but unless
you aim to split the IC's down the middle!! then there will be lead
trapped in the leadframe under the epoxy. This would constitute a fail in
RoHS.
I suggest you either put pressure on you IC manufacturer to supply in a
RoHS compliant leadframe or re-design. Better get your skates on, there
is not much time left.....(re-design, re-qualify etc)
Also I agree with Doug Rohm, it would have to survive the higher
temperatures
Better get that CAD package out....
regards
Paul
Paul R Taylor
Senior Engineer, RoHS Compliancy Group, IED
Pitney Bowes Ltd
The Pinnacles, Elizabeth Way, Harlow, Essex, CM19 5BD
tel: +44 1279 449 744 fax +44 1279 449 594
email: [log in to unmask] website: www.pb.com
"Douglas, Scott" <[log in to unmask]>
Sent by: Leadfree <[log in to unmask]>
27/10/2005 20:38
Please respond to
"(Leadfree Electronics Assembly Forum)" <[log in to unmask]>; Please respond
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"Douglas, Scott" <[log in to unmask]>
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Subject
[LF] Making IC's RoHS Compliant
Dear Group,
We are looking for a way to avoid re-designing a number of PWB to replace
non-RoHS compliant IC's with other compliant (not drop-in replacement)
parts. In a discussion today with our component engineer, we wondered if
we could take our stock of non-RoHS compliant IC's, send them to some lab
someplace, have them (dip, acid etch, whatever) remove the tin/lead solder
plating the leads and then have the leads re-plated with lead-free solder.
This assumes a plastic or ceramic package with standard metal leads, maybe
through hole, maybe surface mount. Could we do this and then claim to be
RoHS compliant? Anything else we should think about in this?
Scott Douglas, NCE
Compliance Engineer
Harman Specialty Group
3 Oak Park Drive
Bedford, MA 01730
Phone: (781) 280-0406
Email: [log in to unmask]
Web: www.harmanspecialtygroup.com
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