OK, OK....Put the Guns Down....(especially if they have leaded bullets!)

I have a customer asking about the reliability of a solder joint that
would be made using a component finished in Matte Tin but, soldered
using SnPb.

His concern is that Tin has a melting point of 217C yet, most SnPb
process target a Max Temp of 210-225C.  

Hasn't Tin been used for years on components?  Has this always been an
issue?  Or, is this new?
Is it an issue?  Do we need to increase our profiles to be above 217C
for some period of time?  If so, what IS that time and what IS that
temp?

Any metallurgists/process folks want to give their 5 cents worth
(yes...it's no longer 2 cents -- the price has gone up to keep in line
with the new cost of our new and improved solder pastes!)

TIA,
Carrie

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