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November 2005

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 2 Nov 2005 11:09:50 -0500
Content-Type:
text/plain
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text/plain (58 lines)
Michael,
Grinding still works, if you have a good enough knowledge of your
component base so you can remove the ones with high Pb die attach BEFORE
grinding.  I would also suggest grinding the board a quadrant at a time,
so if there is a problem you have narrowed it down a bit.
Bev
RIM

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Michael Kirschner
Sent: November 2, 2005 10:46 AM
To: [log in to unmask]
Subject: Re: [LF] Scarier still

Interesting. How did the disti test the parts and where was the Pb
found? Pb
in ICs, for instance, can exist internally to parts as >85% the die
attach
(power components, particularly) and as such is exempt. So grinding the
whole thing up is, as this list knows, not the right approach to
determining
homogeneous material content. And what proof was provided that the parts
were, in fact, compliant?

Fun indeed...

Mike

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