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November 2005

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Subject:
From:
Joe Fjelstad <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 17 Nov 2005 14:09:25 EST
Content-Type:
text/plain
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text/plain (13 lines)
For those who may have interest and be unaware, there is a very good article
with the subject title from above in the October issue of Advanced Packaging
magazine (www.apmag.com) authored by Bev Christian from RIM and two of his
colleagues.

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