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November 2005

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Subject:
Re: Reliability prediction of LF soldering
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 16 Nov 2005 11:43:17 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines) 
Hi Vladimir,
You assume that solder creep-fatigue follows an Arrhenius model with some
activation energy--it does not. Are you telling me, that because the
micromechanism of fatigue is not described in this fashion, all the work that people have
been doing in the whole field of fatigue is useless?



Werner

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