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Subject:	Re: Reliability prediction of LF soldering
From:	Werner Engelmaier <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Tue, 15 Nov 2005 17:06:34 EST
Content-Type:	text/plain
Parts/Attachments:	text/plain (25 lines)

Hi Ofer,
Solder joint creep-fatigue is a wear-out damage mechanism and as such has not
a constant failure rate. thus, the concept of MTBF does not make sense for
solder joints, LF or not.



Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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