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November 2005

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Subject:
From:
Bill Brooks <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Mon, 7 Nov 2005 11:52:30 -0600
Content-Type:
text/plain
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text/plain (73 lines)
Bill,

Is it possible to put a route in between the offending traces? An air gap is
something that wouldn't require a total re-layout of the board, unless
you're
trying to salvage boards already done...and there's traces underneath the
potential
gap.

My two cents anyway...

Bill Brooks (the other one)
CAE Mgr./Librarian
SLM Electronics
11880 Borman Dr.
St. Louis, MO 63146
314.569.0141 EXT 1660
wfbrooks"at"slme"dot"com 



-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
Brooks,Bill
Sent: Monday, November 07, 2005 11:39 AM
To: [log in to unmask]
Subject: [DC] High voltage breakdown... solutions?


It's Monday... had your coffee yet?

I'm trying to gather together some potential solutions to High Voltage
breaking over and arcing between traces on board. The things I know
contribute to this are things like, too little spacing between traces on the
surface or in the inner layers, sharp points on traces, board cleanliness or
the presence of contaminants between the potential voltages. It was
suggested that conformal coating the boards after a real good cleaning might
improve the insulation resistance between traces, has anyone done this
successfully? Do you have any other ideas short of a re-layout of the board
that could perhaps repair a problem like this?

Any ideas are most appreciated.

Bill Brooks - KG6VVP
PCB Design Engineer, C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
Datron World Communications, Inc. _______________________________________
San Diego Chapter of the IPC Designers Council
Communications Officer, Web Manager http://dcchapters.ipc.org/SanDiego/
http://pcbwizards.com

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