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Date: | Thu, 10 Nov 2005 20:00:00 +0200 |
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Hi Ken,
Regarding Tin whisker issues see the paper " iNEMI recommendations on
lead-free finishes for high-reliability product" at their web site
(www.nemi.org/projects/ese/tin_whisker_activities.html).
SAC finish is not backwards compatible, and Bi finishes is questionable.
Regards,
Dr. Gil Zilber
Technologist, Elta system Ltd.
Tel. +972-8-8577240
Mobile +972-54-4983222
http://www.iai.co.il/site/en/iai.asp?pi=17887
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bloomquist, Ken
Sent: Thursday, November 10, 2005 6:58 PM
To: [log in to unmask]
Subject: [TN] Solderable Lead Free Components
Another lead free question, oh boy!
We are an aerospace black box manufacturer serving the commercial
airlines as well as DOD. It looks like it will be a while before we have
to transition to lead free assemblies.
Since a large portion of the industry is going lead free we are getting
notices from our component suppliers that certain components are no
longer available with a tin/lead finish.
So that we don't have to evaluate every component finish notice that
comes in is there a list of finishes that are acceptable and
unacceptable for soldering with tin/lead solder?
We all know that heavy gold plating is not good and some tin plating is
questionable because of "tin whiskers".
Does anybody have some good guidance that might help us with these
component evaluations?
Thanks,
KennyB
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