Well Werner, that is what I'm not completely sure of. I haven't seen any paper, as of yet saying what process controls the life time of the joints; whether it is pure creep, or subcritical crack growth. I agree, there are several analytical models, which however, do not describe the micromechanism.of failure and none of them would answer the question what the true activation energy is (for the process which controls the life time). I think you will agree that without knowing the exact model and the true activation energy, it's almost impossible to predict the life time of a given joint.
Regards,
Vladimir
Vladimir Igoshev, Ph. D.
Senior Materials Researcher
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2
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-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Wednesday, November 16, 2005 11:11 AM
To: Vladimir Igoshev; [log in to unmask]; [log in to unmask]
Subject: Re: [LF] Reliability prediction of LF soldering
Vladimir,
We certainly understand the why and how of solder joint failures, but for LF-solders we cannot as yet quantify it the way we can for SnPb-solders.
Werner
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