Sender: |
|
X-To: |
|
Date: |
Tue, 8 Nov 2005 13:03:12 -0500 |
Reply-To: |
|
Content-type: |
text/plain; charset=US-ASCII |
Subject: |
|
From: |
|
In-Reply-To: |
|
MIME-Version: |
1.0 |
Parts/Attachments: |
|
|
We have a few boards that have multiple layers of Poly-glass. To date we
have seen zero problems when the board is properly supported during
connector insertion. These connectors have survived Military ballistic
shock with no problems.
Bruce Stilmack
GDLS-TO Manufacturing Engineer
(850) 574-4773
[log in to unmask]
Geoff Layhe of
Lamar Group
<[log in to unmask] To
CO.UK> [log in to unmask]
Sent by: TechNet cc
<[log in to unmask]>
Subject
[TN] Press-fit pins and polyimide
11/08/2005 12:29 laminate
PM
Please respond to
TechNet E-Mail
Forum
<[log in to unmask]>
; Please respond
to
Geoff Layhe of
Lamar Group
<[log in to unmask]
CO.UK>
Does anybody have information about the suitability of polyimide (or any
other high temp laminate) with press fit pins.
It doesn't seem a good idea to me to use them with poyimide being more
brittle than FR4 but are there any guidelines anywhere?
Geoff Layhe
Private & Confidential:
This e-mail message is confidential and is intended solely for the person
or organisation to whom it is addressed. If the message is received by
anyone other than the addressee please return the message to the sender by
replying to it and then delete the message from your computer.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
This is an e-mail from General Dynamics Land Systems. It is for the intended recipient only and may contain confidential and privileged information. No one else may read, print, store, copy, forward or act in reliance on it or its attachments. If you are not the intended recipient, please return this message to the sender and delete the message and any attachments from your computer. Your cooperation is appreciated.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|