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October 2005

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Subject:
From:
Franklin Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Franklin Asbell <[log in to unmask]>
Date:
Mon, 3 Oct 2005 13:13:21 -0500
Content-Type:
text/plain
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text/plain (58 lines)
In larger pad/trace (5/6 mil 20 mil pitch) designs there may not be any
fabrication issues, any smaller and the fabricator may lose the ability to
etch properly. With larger features and round pads, teardrops (or similar
pad trace interface enhancer) may be added, the ability to perform this may
drop off on square/rectangle pads of smaller size. When that happens the
fabricator runs a risk of over etching causing opens or reduced trace width.

Just some things to consider.

Franklin



Was wondering what people's thoughts/opinions were about routing from
corners of pads.

Thanks,

Matt

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