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Subject:	Re: New IPC email forum
From:	Franklin Asbell <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Franklin Asbell <[log in to unmask]>
Date:	Wed, 5 Oct 2005 10:50:26 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (46 lines)

In the beginning...yes, TechNet was supposed to cover the complete package
but that's not the situation today (to nobodies fault), most fabricators
have moved on as the forum has transitioned to focus more on assembly and
end user issues. Yes, there are fabricators still subscribed but not like
years past.

Franklin

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Susan Mansilla
Sent: Wednesday, October 05, 2005 10:27 AM
To: [log in to unmask]
Subject: Re: [TN] New IPC email forum

I thought that was what was included in TECHNET.  I have appreciated when
board fabrication questions have been asked, both assemblers and designers -
as
well as - board fabricators have responded.

Susan Mansilla
Robisan Lab

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